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Optocoupler offers lower operating voltage


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Courtesy of eeProductCenter

Irvine, Calif. — Toshiba America Electronic Components, Inc., (TAEC) has launched the company's first 3.3-V, 20 MegaBaud (MBd) high-speed IC photocoupler. The TLP2066 device addresses isolation requirements and switching noise elimination in switching power supplies, instrument I/O, computer peripheral interfaces, high-speed disk drive I/O, microprocessor system interfaces, bus drivers for networking applications, and high-speed logic systems.

Offering high-speed switching, low propagation delay, high isolation voltage and high transient immunity, the TLP2066 device achieves a level of performance similar to Toshiba's 5-V, 20 MBd TLP116 IC photocoupler, at a lower operating voltage. In addition, it features a high tolerance for noise with a common mode transient immunity ratio (CMR) of 15 kV/μs, compared to theTLP116's CMR of 10 kV/μs.

Other key specifications include:

  • Input current logic low output: 5 mA
  • Output current (max.): 10 mA
  • Propagation delay (max.): 60 ns
  • Supply current (max.): 5 mA
  • Isolation voltage (min.): 3750 Vrms

The TLP2066 is offered in a compact 5-pin MFSOP6 package, measuring 4.4 x 3.6 x 2.5 mm, which is suitable for space-constrained applications. The optocoupler also features a wide operating temperature range of -40°C to 100°C, and is compatible with the lead-free reflow solder process and meets RoHS-compatible requirements.

Pricing: $1.50 each.
Availability: Samples of the 3.3-V, 20 MBd TLP2066 are available now. Mass production is targeted to start in July 2007.

Toshiba America Electronic Components, Inc., www.chips.toshiba.com

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